Magnum Semiconductor Empowering Audio Video Experience

Bo Liu

Vice President, Applications Engineering

Bo Liu joined Magnum in October 2005 from Mediatek, where he served as vice president of China software engineering. He brings 20 years of software development and customer application experience to Magnum.

Prior to Mediatek, Liu served as vice president of software development for Tvia, Inc., a fabless semiconductor company which designs display processors for various multimedia devices. Prior employment includes lead software engineering positions at Micronics Computers and Oak Technology.

Liu earned a BSEE from Hefei Polytechnic University in Hefei, China and was awarded an MSEE from Wichita State University, Kansas. He was also a Ph.D. candidate at the University of Wisconsin - Madison.

Gopal Solanki

President & Chief Executive Officer

President & CEO

Dr. Jack Guedj

Founder and Chief Technology Officer

Founder and CTO

Terry Griffin

Vice President of Finance & Chief Financial Officer

V.P. Finance & C.F.O.

Marcel Tromp

Vice President, Architecture and VLSI Engineering

V.P. Architecture & VLSI

Dr. Fure-Ching Jeng

Vice President, Engineering - Software Development

V.P. Software

Bo Liu

Vice President, Applications Engineering

V.P. Applications Engineering

Melvin Hirata

Senior Director and Acting General Manager, ZEVIO Product Line

Acting G.M. ZEVIO

Steve Musallam

Vice President, Consumer Product Marketing

V.P. Consumer Product Marketing

Scott Cho

Vice President, Worldwide Sales

V.P. Worldwide Sales

Bob Saffari

Vice President of Marketing, Settop and Broadcast Products

V.P. Marketing, Settop & Broadcast Products