Magnum Semiconductor Hires New Key Executives of Advanced Development and Application Engineering

Magnum Lures Top Talent from Competitors LSI Logic And Mediatek To Fill Key Engineering Slots

January 3, 2006

MILPITAS, Calif., Jan. 3, 2006 -- Magnum Semiconductor announced today that it has brought two new key executives into its top management staff: Nedi Nadershahi as the new vice president of advanced development and Bo Liu, as vice president of applications engineering.

“Both of these talented individuals have distinguished records in the industry and will significantly add to Magnum’s ability to deliver industry-leading DVD solutions to the marketplace,” said Dr. Jack Guedj, CEO of Magnum Semiconductor. “It is a tribute to the vision of Magnum Semiconductor and the strength of our products that we could attract such highly respected individuals to our team from some of the top competitors.”

Nedi Nadershahi will be responsible for Magnum’s engineering and development for advanced products and part of its long-term expansion strategy for the enhancement of Magnum’s product roadmaps. He was previously employed at LSI Logic, where he held the position of director of engineering since 2002. Prior to LSI Logic, Nadershahi helped build the technical infrastructure of Oak Technology, where he served as its vice president of research and development and created a strong engineering team and vast roadmap of DVD front-end processor ships, which resulted in unprecedented growth for the company. Nadershahi also spent a combined 18 years at Hitachi Semiconductor National Semiconductor. He has a BSEE from Washington University in St. Louis, Missouri.

Bo Liu, vice president of applications engineering, has joined Magnum from Mediatek, where he served as its vice president of China software engineering. Prior to Mediatek, Liu served as vice president of software development for Tvia, Inc., a fabless semiconductor company which designs display processors for various multimedia devices. While there, Liu was instrumental in developing Tvia’s chip-related software and responsible for the initiation and implementation of the DVB, MPEG-4 and Home IT projects. Prior employment includes lead software engineering positions at Micronics Computers and Oak Technology.

Liu earned a BSEE from Hefei Polytechnic University in Hefei, China and was awarded an MSEE from Wichita State University, Kansas. He was also a Ph.D. candidate at the University of Wisconsin – Madison.

Magnum also announces today that William Wong has joined Magnum Semiconductor as its Senior Director of Strategic Partnerships and New Business Development.

About Magnum Semiconductor

Magnum Semiconductor is a premier provider of chips, software, reference platforms and engineering support services for recording, viewing and managing highquality audio/video content. Magnum Semiconductor is headquartered in Milpitas, Calif. with sales and engineering offices in Canada, China, India, Japan, Korea, and Taiwan. Further information is available at www.magnumsemi.com.

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